Iimpawu zobugcisa:

1. Isequin yokufefa ngegolide ekungekho lula ukuwisa umgubo, equka i-substrate, umaleko obonakalisayo kunye nefilimu yokufefa yegolide encanyathiselwe kwindawo ephezulu nangaphantsi ye-substrate, ephawulwe ngokuba umaleko okhanyayo uphakathi kwe-substrate kunye ne-substrate. ifilimu yokufafaza igolide, kunye nefilimu yokufafaza igolide kunye noluhlu olubonakalayo ludibaniswe kwaye luxhunywe ngoluhlu lweglue;Ifilimu yokufafaza igolide iquka umaleko wegolide, iglue kunye nefilimu ephantsi, i-golden powder layer kunye ne-glue layer ifumaneka kwifilimu engezantsi, kwaye i-glue layer ifumaneka phakathi komgangatho wegolide kunye nefilimu engezantsi.

2. I-Sequin yokufafaza igolide ekungekho lula ukuwisa umgubo ngokwebango le-1, ebonakaliswe ngokuba umphezulu womgangatho wokufafaza wegolide unikwe umaleko okhuselayo, ongumaleko ocacileyo.